SAS Student Reports (FYP/IA/PA/PI)
Collection of: <br>Final Year Project (FYP) <br>Industrial Attachment (IA) <br>Professional Attachment (PA) <br>Professional Internship (PI)
(2004)The project undertaken involved development of the encapsulation materials and process for the uBGA package. Two types of uBGA packages were evaluated.
(1999)Two projects were discussed: Solaris secure template project and knowledge base project.
(1999)This report provides details of the design and simulation of a hybrid handphone prototype that incorporates phone, pager and Personal Digital Assistant features. The aim of the project is to obtain feedback from users ...
(1999)The report aims to enable the reader to understand the authores attachment better. It consist of : industral attachment, project design and implementation and CD-ROM video presentation.