Design evaluation of microelectronics devices using focused ion beam technology
Yeo, Swee Hock.
Date of Issue2005
School of Mechanical and Aerospace Engineering
With the advent of new technology, the circuitry lines within the IC chip are getting more and more higher in density. Miniaturisation of IC chips has forced many IC manufacturers to go to and beyond deep-sub-micron technology. The present IC technology still stands at less than 0.35 micron. But in 2003 or in 2004, the technology will move towards less than 0.1 micron. In fact, some technologically advanced countries like USA are already working on less than 0.13 micron technology. In anticipation, many of the IC manufacturers are preparing for this imminent change that will inevitably take place in the near future. To be able to achieve the above, critical tools (e.g. focus-ion beam) and the relevant expertise and competencies have to be developed. In short, local technology support must be put in place. This is timely as we move forward to 2004, semiconductor industry will be a major pillar in Singapore's technological and industrial base.
DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Nanyang Technological University