dc.contributor.authorGuo, Ningqun.en_US
dc.contributor.authorLing, Shih Fu.en_US
dc.date.accessioned2008-09-17T14:39:08Z
dc.date.available2008-09-17T14:39:08Z
dc.date.copyright2000en_US
dc.date.issued2000
dc.identifier.urihttp://hdl.handle.net/10356/6992
dc.description.abstractThis report describes the work undertaken under an applied research project that aims to study the dynamic characteristics of the wire bonder, and consists of two major parts, dynamic of ultrasonic transducer and modelling of bonding processen_US
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Manufacturing::Product engineering
dc.titleDynamic characteristics of ultrasonic wire bondersen_US
dc.typeResearch Reporten_US
dc.contributor.schoolSchool of Mechanical and Production Engineeringen_US
dc.description.reportnumberRG 28/96


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