dc.contributor.authorGuo, Ningqun.en_US
dc.contributor.authorLing, Shih Fu.en_US
dc.contributor.authorWong, Brian Stephen.en_US
dc.date.accessioned2008-09-17T14:38:13Z
dc.date.available2008-09-17T14:38:13Z
dc.date.copyright2004en_US
dc.date.issued2004
dc.identifier.urihttp://hdl.handle.net/10356/6966
dc.description.abstractThere are many interfaces in IC packaging, such as that between mold compound and silicon chip, and that between silicon die, die attach and copper lead-frame. The quality of these interfaces has been a critical issue in the reliability testing of IC packaging and during the manufacturing process as the packages become thinner and denser. Common defects such as delamination and crack can be detected using C-mode scanning acoustic microscope with sufficient confidence. However, weak interface due to weak adhesion has often gone undetected and may become potential defective area at a later stage. It is desirable to develop a more quantitative method to characterize the weak interface nondestructively, and this has been the motivation and focus of the study.en_US
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
dc.titleNondestructive evaluation interfaces defects IC packagingen_US
dc.typeResearch Reporten_US
dc.contributor.schoolSchool of Mechanical & Production Engineeringen_US


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