Ultra-precision machining and micro fabrication of advanced materials for optical applications

Abstract

In this project, precisionhltra-precision ductile-mode machining of brittle materials was conducted, and precisionhltra-precision measurement techniques and a method for inspection of semiconductor wafers with micro fabricated devices were developed. By using a simple dressing device developed and an improved cooling system, better surface finish could be achieved compared to that when the conventional dressing and cooling methods were used. A higher grinding wheel speed produces a smaller cutting depth and undeformed chip thickness, and thus smaller grinding force, decreased residual surface stress, and better surface finish. The surfaces of the ceramics ground at high wheel speeds were free from burrs, scratches, chips, porous area, fins and ridges. The removal mechanism for ZrO2 was similar to that for metals particularly at a high wheel speed. The surface texture was improved due to folding of asperities. High productivity and good surfaces with ductile streaks could be obtained by employing ultra-high-speed grinding even at very large wheel depths of cut such as 400um without cross feed.