View Item 
      •   Home
      • 1. Schools
      • College of Engineering
      • School of Electrical and Electronic Engineering (EEE)
      • EEE Student Reports (FYP/IA/PA/PI)
      • View Item
      •   Home
      • 1. Schools
      • College of Engineering
      • School of Electrical and Electronic Engineering (EEE)
      • EEE Student Reports (FYP/IA/PA/PI)
      • View Item
      JavaScript is disabled for your browser. Some features of this site may not work without it.
      Subject Lookup

      Browse

      All of DR-NTUCommunities & CollectionsTitlesAuthorsBy DateSubjectsThis CollectionTitlesAuthorsBy DateSubjects

      My Account

      Login

      Statistics

      Most Popular ItemsStatistics by CountryMost Popular Authors

      About DR-NTU

      Study of thermal conductivity for polycrystalline diamond

      Thumbnail
      Report_Yang Geer_U1321238F.pdf (2.104Mb)
      Author
      Yang, Geer
      Date of Issue
      2016
      School
      School of Electrical and Electronic Engineering
      Abstract
      Thermal dissipating is very important in the semiconductor industry, because every semiconductor component has its own junction temperature, with current goes through the component, it will generates a lot of heat, if those heat cannot dissipate in time, the functions and life time of the semiconductor component will be heavily affected. In this project, synthetic diamond is chosen to be used as a heat dissipation material because according to the previous research results, diamond has a lot higher thermal conductivity (around 5 times) and lighter density than copper, which is usually being used in industrial heat dissipation. The synthetic diamond being used in this project is grown by MPCVD (Microwave Plasma Chemical Vapour Deposition) method. To test the thermal conductivity of this synthetic diamond, need to process by testing the TCR (temperature coefficient Resistance) of specimen diamond with probe station analysis, after that if test results meet requirement then proceed to IC packaging and wire bonding, final step is to use 3ω system measure and record data of specimen diamond and with the help of Origin 8 software data analysis to get thermal conductivity. In order to find out what parameters affect the thermal conductivity, studying Raman spectra and PL (Photoluminescence) of the diamond specimen would be considering helpful, again with the help of Origin 8 software, maybe will find out what is actually affecting the thermal conductivity of the synthetic diamond.
      Subject
      DRNTU::Engineering
      Type
      Final Year Project (FYP)
      Rights
      Nanyang Technological University
      Collections
      • EEE Student Reports (FYP/IA/PA/PI)

      Show full item record


      NTU Library, Nanyang Avenue, Singapore 639798 © 2011 Nanyang Technological University. All rights reserved.
      DSpace software copyright © 2002-2015  DuraSpace
      Contact Us | Send Feedback
      Share |    
      Theme by 
      Atmire NV
       

       


      NTU Library, Nanyang Avenue, Singapore 639798 © 2011 Nanyang Technological University. All rights reserved.
      DSpace software copyright © 2002-2015  DuraSpace
      Contact Us | Send Feedback
      Share |    
      Theme by 
      Atmire NV
       

       

      DCSIMG