Development of Pb-free solder for electronic assembly.
Date of Issue2004
School of Materials Engineering
This project aimed (1) to look for new lead-free solder alloy systems with improved properties for electronic packaging and assembly, (2) to study the effects of microstructural evolution on the reliability of the solder joints, and (3) to investigate the growth kinetics of the IMC formation in solder joints based on establishing new theoretical model.
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Nanyang Technological University