Wire bond process development for low K (dielectric constant) materials.
Tan, Jonathan Yang Kern.
Date of Issue2004
School of Mechanical and Aerospace Engineering
Describes results achieved in establishing a wire bonding process with different bonding wire types - 99% (2N) purity gold wire, 99.99% (4N) purity softer gold wire, 99.99% (4N) purity stiff gold wire. A relationship between the bulk material hardness of gold wire and the underpad failure mechanism will be established.
Nanyang Technological University