Development of high strength gold bonding wires for fine pitch wire bonding process
Dong, Albert Renjun
Date of Issue2000
School of Mechanical and Aerospace Engineering
This project focused on the development of new gold bonding wires, which has high modulus and break load. Various combinations of alloying elements were used to dope the pure gold forming different alloys. The mechanical properties including break load at certain elongation level and elastic modulus were used to determine the effectiveness of alloy strengthening element. It was found that Beryllium, and Calcium have most strengthening effect at low concentration level while Platinum and Copper have very good strengthening effect at high concentration level.
Nanyang Technological University