Quality and process improvement of die and glass attach operation for smart optical package (SmOP)
Tang, Hong Cung.
Date of Issue2005
School of Mechanical and Aerospace Engineering
The purpose of this work is to study and evaluate in detail the quality control of the image sensors assembly process as well as to improve the process capability. The die and glass attachment process is one of the major contributors to daily production yield loss. Thus, this work covers the die and glass attachment operation and manufacturing processes.
Nanyang Technological University