Improved edge uniformity in chemical & mechanical polishing of wafer by means of guide ring pressure using springs.
Tan, Chek Soon.
Date of Issue2003
School of Mechanical and Aerospace Engineering
In this project, a new carrier has been proposed via using simple springs to provide the pressurized guide-ring to improve the overall uniformity at a very much affordable cost. The first prototype uses polyphenylene sulfide (PPS) as the material for the rotating carrier. The second prototype uses ceramics as the carrier's material.
Nanyang Technological University