Development of a 3D optical testing system for the study of IC packaging.
Date of Issue2004
School of Mechanical and Aerospace Engineering
The main objective of this study is to develop an advanced 3-D optical testing system to measure the deformations of IC packages accurately and comprehensively. The present study consists of two parts: 1) development and construction of an advanced compact 3-D optical testing system; and 2) application of the 3-D optical testing system to IC packages for their hygro-thermo-mechanical reliability evaluation.
Nanyang Technological University