dc.contributor.authorAng, Derrick Jia Hao
dc.date.accessioned2015-05-19T05:22:19Z
dc.date.available2015-05-19T05:22:19Z
dc.date.copyright2015en_US
dc.date.issued2015
dc.identifier.urihttp://hdl.handle.net/10356/63816
dc.description.abstractThis report introduce the research status of thermoelectric cooling on semiconductors such as diode and semiconductor wafer. Measurement of current-voltage characteristic of semiconductor diodes by applying thermoelectric cooling device to determine how temperature affects its quality and operation. In addition, experiments are conducted on epitaxial silicon-germanium wafers on hot plate and by applying thermoelectric cooling device to determine the effect of thermal dissipation using Fourier’s law to show the effect of thermoelectric cooling. Measurement results and findings of the experiments will be discussed in detail in this report.en_US
dc.format.extent65 p.en_US
dc.language.isoenen_US
dc.rightsNanyang Technological University
dc.subjectDRNTU::Engineering::Electrical and electronic engineeringen_US
dc.titleReduced temperature electrical measurement of semiconductor devicesen_US
dc.typeFinal Year Project (FYP)en_US
dc.contributor.supervisorWong Kin Shun, Terenceen_US
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen_US
dc.description.degreeBachelor of Engineeringen_US


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