Lead-free PCB assembly and effect of solder joint profile on the reliability of PCB assembly
Date of Issue2004
School of Mechanical and Aerospace Engineering
Lead-free Printed Circuit Board (PCB) assembly evaluation was undertaken to determine the effect of solder joint profile on the reliability of PCB assembly, by varying the foot print design on the PCB, solder paste deposition volume and solder reflow profile. PCBs were designed and fabricated with daisy chain loops connected to land pads of daisy chained Ball Grid Array (BGA) components with pad dimensions of 0.56 and 0.66mm NiAu finish. Material characterization and process validation was carried out.
Nanyang Technological University