Operating curve management application for productivity improvement at wirebond.
Ooi, Theng Hock.
Date of Issue2004
School of Mechanical and Aerospace Engineering
Introduce the Operating Curve Management (OCM) concept and its application in the wirebonding process in the semiconductor environment, to allow the user to localize and optimize the available resources, to judge the potential of different improvement alternatives and to rate the results of the improvement actions.
Nanyang Technological University