dc.contributor.authorMoey, Chin Hui.en_US
dc.date.accessioned2008-09-17T11:08:13Z
dc.date.available2008-09-17T11:08:13Z
dc.date.copyright2005en_US
dc.date.issued2005
dc.identifier.urihttp://hdl.handle.net/10356/6164
dc.description.abstractIn this work, the characterisation of the vibration profile of the bonding tool as a result of thermosonic application on a piezo-stacked transducer was studied. The work seeks to better understand the fundamental principles governing the structural response and dynamic response of a lead zirconate titinate (PZT) crystal stack when exposed to small electrics fields.en_US
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Manufacturing
dc.titleCharacterisation of thermosonic applications in wire bonding.en_US
dc.typeThesisen_US
dc.contributor.supervisorButler, David Lee.en_US
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.description.degreeMSC(PRECISION ENGINEERING)en_US


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