Monolithic integration of GAAS-to-SI by direct wafer bonding
Yeo, Chiew Yong
Date of Issue2013
School of Electrical and Electronic Engineering
Singapore-MIT Alliance Programme
While Silicon remains the dominant material today in matured very-large-scale-integration technology, most of the III-V compound semiconductors are direct bandgap materials with high electron mobilities that are highly sought in advanced space, automobile, and telecommunication applications. Hence, it would be ideal to integrate the best of Silicon and III-V compound semiconductors.