Processibility and reliability of conductive adhesive materials.
Lim, Pei Siang.
Date of Issue2005
School of Mechanical and Aerospace Engineering
This project aims to study the effects of different bonding parameters such as bonding pressure, temperature, time during assembly process in relation to the assembly yield and the reliability of the Anisotropic Conductive Film (ACF) joints. The ACF used in this project is Hitachi AC212B ACF. Differential scanning calorimetry (DSC) is used to characterize the degree of cure of the ACF at different temperature and time. Different evaluations will be carried out to investigate the effects of different bonding parameters on contact resistance of the ACF joints.
Nanyang Technological University