dc.contributor.authorLi, Jianjun.en_US
dc.date.accessioned2008-09-17T11:04:18Z
dc.date.available2008-09-17T11:04:18Z
dc.date.copyright2001en_US
dc.date.issued2001
dc.identifier.urihttp://hdl.handle.net/10356/5988
dc.description.abstractIn this study, three different plastic substrates were tested by TGA, TMA, DMA and absorption/desorption in order to obtain their mechanical, thermal and physical properties.en_US
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Manufacturing
dc.titleAdvanced electronic packaging substrate (ball grid array)en_US
dc.typeThesisen_US
dc.contributor.supervisorYi, Sungen_US
dc.contributor.schoolSchool of Mechanical and Production Engineeringen_US
dc.description.degreeMaster of Science (Precision Engineering)en_US


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