Finite element analysis on overall mechanical properties of molding compounds in electronic packaging
Leong, Sook Har.
Date of Issue2000
School of Mechanical and Aerospace Engineering
In this thesis, effective elastic moduli of molding compound materials in plastic electronic packages were investigated. The materials are composed of epoxy matrix and silica fillers. Since it is quite difficult to analyze three-dimensional multi-inclusion interaction problems by Finite Element Method (FEM), where as the conclusions of two-dimensional problems are revelatory to three-dimensional problems, composites composed of a matrix and unidirectional aligned fibers or inclusions modeled as two-dimensional plane strain problems, are analyzed by FEM.
DRNTU::Engineering::Materials::Electronic packaging materials
Nanyang Technological University