Stress evaluation in thin films.
Lalita Varma P. V. S. N.
Date of Issue2001
School of Mechanical and Aerospace Engineering
We are in the midst of a major technology transition from alumni to copper as the metallization material. In the present study, a comprehensive examination of the change in the stress state due to this technology transition has been made, which is done by repeating the experiments that were done on aluminium and comparing the results when the same tests were done on copper.
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
Nanyang Technological University