Dynamic characteristics of the wire bonding process in electronic packaging.
Date of Issue2002
School of Mechanical and Aerospace Engineering
This thesis describes the work performed to study the dynamic characteristics of the wire bonder, in particular the transducer and bonding process. The effect of polarization in a piezoelectric stack is discussed too. The analysis is also extended to the steady-state response, and discussions and comparisons are made with respect to the transient response.
Nanyang Technological University