Wire sweep analysis for 16L SOIC package.
Gao, Zheng Yu.
Date of Issue2002
School of Mechanical and Aerospace Engineering
In this paper, we will analyses the root cause of wire sweep and using CAE tools to simulate mold flow in the mold chase and optimize mold chase design. Taguchi Methods, DOE is also using to optimize molding process. 16L SOIC is our test vehicle, our target is reduce wire sweep from more than 10% to less than 5%.
Nanyang Technological University