Mechanics of thin film adhesion
Date of Issue2002
School of Mechanical and Aerospace Engineering
The aim of this work was to refine the understanding and application of the flat-rectangular-punch (Model I) and axisymmetric-flat-punch (Model II) adhesion test, which were modified and reinforced V-peel and shaft-loaded blister test, respectively.
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
Nanyang Technological University