dc.contributor.authorChua, Riwis Ian Ping.en_US
dc.date.accessioned2008-09-17T10:55:44Z
dc.date.available2008-09-17T10:55:44Z
dc.date.copyright2002en_US
dc.date.issued2002
dc.identifier.urihttp://hdl.handle.net/10356/5646
dc.description.abstractThis paper outlines the technology difference between VFM and conventional curing, the benefits of VFM curing and shares some initial experiences with the Plastic Ball Grid Array and ways to improve the VFM process.en_US
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Manufacturing
dc.titleVariable frequency microwave (VFM) curing for PBGA and FSBGA packagesen_US
dc.typeThesisen_US
dc.contributor.supervisorPang, John Hock Lyeen_US
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.description.degreeMSC(MECHANICS and PROCESSING OF MATERIALS)en_US


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