Process development for PECVD equipment
Yang, Jian Jun
Date of Issue2003
School of Mechanical and Aerospace Engineering
Process for depositing silicon nitride film by using Micro-90011 PECVD system has been developed. The stress test structure simulation, fabrication and system performance improvement have been studied in the project. The studies are carried out stress measurements at a device level by using micromachined structure. The results can be applied for PECVD deposited silicon nitride film for MEMS device design. A typical, applicable circular and rotation structure was successful fabricated.
Nanyang Technological University