Study of solder joints for ball grid array (BGA) assembly
Yam, Shong Wai
Date of Issue2002
School of Mechanical and Aerospace Engineering
This thesis aims to study failure characteristics of solder joints (10Sn/90Pb solder ball and eutetic Sn-Pb solder fillet) in Ceramic Ball Grid Array (CBGA) and assembly, and investigate the effect of Accelerated Thermal Cycling (ATC) and reflow atmosphere on joint failure. Metallographic sections and fracture surfaces of solder joints were examined using optical and Scanning Electron Microscope (SEM).
Nanyang Technological University