Characterization of aluminium pad under different process conditions.
Wang, Jian Hua.
Date of Issue2004
School of Mechanical and Aerospace Engineering
The objective of this study is to improve the aluminum film uniformity by optimizing the process condition. The aluminum film was deposited by a sputtering process on 200mm wafers in AMAT Endura® PVD chambers.
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
Nanyang Technological University