Surface and subsurface damage investigation and CFD modeling of CMP for optical silicon substrate
Date of Issue2012
School of Mechanical and Aerospace Engineering
Precision optics and photonic applications using silicon substrates nowadays demand high production efficiency with nano-level surface quality and shallow sub-surface damage. Modem machining technologies need to evolve further to not only improve surface quality but also subsurface morphology. In the optical and semiconductor industry chemical mechanical polishing (CMP) is an established finishing process to minimize the subsurface damage and improve the surface quality. As a supplement to slurry based CMP, fixed abrasive CMP has been explored in this study as an alternative to lapping and partial traditional CMP. This is to achieve a fine balance between material thinning rate and subsurface damage depth.