Structures and properties of thermally conductive thermoplastic composites
Author
Ng, Hsiao Yen.
Date of Issue
2004School
School of Materials Science and Engineering
Abstract
Formulate thermoplastic composites that offer high thermal conductivity and good electrical insulating properties for electronic packaging purposes. Examine other important properties such as rheological properties (ease of processing) and the mechanical properties (end use performance).
Subject
DRNTU::Engineering::Materials::Composite materials
Type
Thesis
Rights
Nanyang Technological University
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