dc.contributor.authorLim, Boon Kiat.en_US
dc.date.accessioned2008-09-17T10:19:23Z
dc.date.available2008-09-17T10:19:23Z
dc.date.copyright2004en_US
dc.date.issued2004
dc.identifier.urihttp://hdl.handle.net/10356/5077
dc.description.abstractSince the advent of microelectronics and wafer fabrication, the need for diffusion barriers/adhesion promoters in interconnect systems to enhance mechanical stability and prevent interdiffusion has emerged. This studey investigated the integrity of TiN diffusion barriers in A1 interconnect system.en_US
dc.format.extent149 p.
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
dc.titleStudy on diffusion barriers for multilevel interconnect in advanced semiconductor devicesen_US
dc.typeThesisen_US
dc.contributor.supervisorPark, Hun Suben_US
dc.contributor.schoolSchool of Materials Science and Engineeringen_US
dc.description.degreeDoctor of Philosophy (SME)en_US


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