Study on diffusion barriers for multilevel interconnect in advanced semiconductor devices.
Lim, Boon Kiat.
Date of Issue2004
School of Materials Science and Engineering
Since the advent of microelectronics and wafer fabrication, the need for diffusion barriers/adhesion promoters in interconnect systems to enhance mechanical stability and prevent interdiffusion has emerged. This studey investigated the integrity of TiN diffusion barriers in A1 interconnect system.
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Nanyang Technological University