Chemical mechanical polishing process of copper metallization in the ULSI devices.
Leow, Nelson Whatt Wei.
Date of Issue2004
School of Materials Science and Engineering
Explore techniques capable of reducing Cu dishing significantly. All techniques studied will focus on minimizing both topology and Cu interconnect sheet resistance. Factors affecting Cu removal and hence topology would also be investigated.
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Nanyang Technological University