Electroplating of copper metallization of sub-micron integrated circuits
Law, Shao Beng.
Date of Issue2001
School of Materials Science and Engineering
In this project, plating in electrolytes with and without additives was evaluated. The impact of these electrolytes and various plating parameters such as current density, current pulse waveforms, wafer rotation on the characteristics of the plated Cu film were studied.
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Nanyang Technological University