Intermetallic formation and growth at the interface between copper and Sn-Pb solders and its effects on joint strength
Kithva Prakash Hariram.
Date of Issue2003
School of Materials Science and Engineering
This work details the effect of Lead, a heavy metal toxin, on the interfacial reaction between Cu and Sn-Pb solders and the tensile fracture of solder joints.
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Nanyang Technological University