Surface chemical study on the oxidation resistance of plasma-treated copper.
Wong, Andrew See Weng.
Date of Issue2000
School of Materials Science and Engineering
In this article, we have also demonstrated the use of XPS, AES, FTIR, RS, XRD, TEM, FE-SEM for studying copper oxidation and, for the first time, studied the surface chemistry and oxidation-resistance of the C, N and Cu-containing films.
Nanyang Technological University