Study of the interfaces between electroless nickel under bump metallization and lead-free solders
Date of Issue2004
School of Materials Science and Engineering
This work focuses on the interfacial reaction between Sn-bearing solders (lead-free Sn-3.5Ag and eutectic Sn-37Pb) and Ni-based UBMs (electrolessly plated Ni-P and sputtered Ni) in terms of morphology and growth kinetics of the intermetallic compound. Effect of interfacial reaction on the mechanical strength of the solder joints has been studied using a tensile test. Comparison of these solder/UBM systems is made in order to obtain a systematic and comprehensive understanding of the interaction in reflow and thermal aging processes. There are three separate but interrelated sub-topics in the present experimental investigation.
DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Nanyang Technological University