Characterization and modeling of on-chip interconnects for silicon RFIC design.
Ong, Beng Hwee.
Date of Issue2005
School of Electrical and Electronic Engineering
The characterization and modelling of on-chip interconnects had been carried out in this project. First, an overview of the on-chip interconnect on lossy silicon-based process is presented. Second, on-wafer high frequency measurements of the on-chip interconnects are carried out and investigated in depth.
DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
Nanyang Technological University