Self-aligned dual damascene processing technique to improve copper interconnect performance
Neo, Chin Chuan
Date of Issue2004
School of Electrical and Electronic Engineering
Improving the process and reliability of copper via-line metallization using a proposed novel self-aligned dual damascene approach for the 0.13 urn technology generation. Collective process issues when implementing industrial primary DD approaches led to the invention of the DD approach.
DRNTU::Engineering::Electrical and electronic engineering
Nanyang Technological University