Electrochemical plated copper for interconnect applications
Loh, Stephen Soon Ann.
Date of Issue2004
School of Electrical and Electronic Engineering
Obtain a fundamental understanding of the interactions between the organic additives and their effects on mechanism of the plating process. Study the effects of current density (both DC and pulsed waveform) on the properties of Cu films electroplated from baths with different additives. Study the effects of substrate on the properties of the electroplated Cu films.
DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials
Nanyang Technological University