Wafer-level isothermal electromigration study on deep sub-micron interconnect metallization.
Lim, Yeow Kheng.
Date of Issue2002
School of Electrical and Electronic Engineering
The main focus is to further develop the accelerated wafer-level ISO-J and IOS-T EM tests with the possibility of incorporation into wafer fabrication for rapid EM evaluation of new interconnect metallization.
DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Nanyang Technological University