Investigation of laser micro drilling
Chung, Li Hua.
Date of Issue2011
School of Electrical and Electronic Engineering
Laser micromachining has been widely used to process brittles materials for many industrial engineering and applications. The use of DPSS Nd: YVO4 Awave 532nm-5W 40K Green Laser Machine to process various type of brittle materials is employed to investigate its laser processing effect in terms of surface quality, roundness of holes, taper tolerance, depth of cutting and shorter processing time. This is achieved by fine tuning the laser parameters of the green laser machine. The advantages of using the Green Laser Machine is due to the attribute of its high peak power and high pulse energy inherent from its nanosecond short pulse duration characteristic operating in Q-switched mode. In performing laser processing, it is essential to understand the concepts of taper, overlap, laser power, beam focus position, type of focus and also the formation of HAZ and recasts. The theory of these concepts is being discussed in the literature review part of the thesis. Several experiments have been carried out for investigation of laser micro drilling using the Green Laser Machine. They are depth of cutting on 1600um white ceramic (Al2O3), cutting of an 8 inch silicon wafer, cutting of Aluminum Nitrate (AlN), cutting and drilling of stainless steel, investigation of holes circularity and processing time using percussion and trepanning drilling and lastly cutting of ferrite. The results are reflected in Chapter 3 to Chapter 8 of the thesis.
DRNTU::Engineering::Electrical and electronic engineering::Industrial electronics
Final Year Project (FYP)
Nanyang Technological University