Optimization of hot embossing parameters in the microfabrication of COC microfluidic device

Abstract

Since the commercialization of microtechnology, low cost production together with reliable

and efficient fabrication techniques has become the top deciding factors among

manufacturers. The effectiveness of hot embossing micro features onto polymer substrate

has been proven by past research. However, the replication quality differs with varying key

process parameters such as embossing temperature, pressure (load) and holding time.

Hence, the next challenge is to develop a systematic way of optimizing the process

parameters with a goal of obtaining consistently good replication quality.

The purpose of the project is to investigate the effects and optimize the 3 key hot embossing

parameters. The Design of Experiments (DOE), particularly 2k experiment is used to screen

the effects of these parameters while the optimization method (where further experiments

are carried out) to obtain the minimum demolding energy with good replication channel

quality. Excessive demolding energy is undesirable because it means that the specimen is

subjected to large thermal stresses which may hamper good channel definition.