Characteristics of chemical mechanical polishing in advanced wafer processing.
Huang, Wen Ke.
Date of Issue2003
School of Electrical and Electronic Engineering
Chemical Mechanical Polishing (CMP) is the only option for achieving local and global planarization to meet the requirement of photolithography to build multi-level interconnection layers. It is the best planarization method because of its ability to get longer length scales than traditional planar techniques.
DRNTU::Engineering::Electrical and electronic engineering::Semiconductors
Nanyang Technological University