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      Simulation and characterization of the inductive-coupled plasma chemical vapour deposition of nano-sized materials.

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      EEE-THESES_36.pdf (1.924Mb)
      Author
      Asutosh Srivastava.
      Date of Issue
      2004
      School
      School of Electrical and Electronic Engineering
      Abstract
      The details of Inductively Coupled Plasma and Chemical Vapor Deposition and their integration is given. The details of PIC simulation are discussed. The results of characterization of the films formed making use of the optimum parameters is also discussed.
      Subject
      DRNTU::Engineering::Electrical and electronic engineering::Nanoelectronics
      Type
      Thesis
      Rights
      Nanyang Technological University
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      • EEE Theses

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