Simulation and characterization of the inductive-coupled plasma chemical vapour deposition of nano-sized materials.
Date of Issue2004
School of Electrical and Electronic Engineering
The details of Inductively Coupled Plasma and Chemical Vapor Deposition and their integration is given. The details of PIC simulation are discussed. The results of characterization of the films formed making use of the optimum parameters is also discussed.
DRNTU::Engineering::Electrical and electronic engineering::Nanoelectronics
Nanyang Technological University