Simulation and characterization of the inductive-coupled plasma chemical vapour deposition of nano-sized materials.

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Author
Asutosh Srivastava.
Date of Issue
2004
School
School of Electrical and Electronic Engineering
Abstract
The details of Inductively Coupled Plasma and Chemical Vapor Deposition and their integration is given. The details of PIC simulation are discussed. The results of characterization of the films formed making use of the optimum parameters is also discussed.
Subject
DRNTU::Engineering::Electrical and electronic engineering::Nanoelectronics
Type
Thesis
Rights
Nanyang Technological University
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