Automation of Ball Grid Array (BGA) intergrated circuit manufacturing line
Joseph Erasmo A. Galang
Date of Issue2003
School of Electrical and Electronic Engineering
This thesis is an example of how we can adopt a strategy to be cost competent in launching new Integrated Circuit (IC) packages in the market. On e is in an environment wherein the cost of manufacturing is far above and beyond many South East – Asian coutries especially in terms of manpower, material or cost of producing the product.
DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Nanyang Technological University