Design and application of precision automation for various semiconductor electronic packaging technologies.
Chew, Keng Hock.
Date of Issue2003
School of Electrical and Electronic Engineering
The ongoing miniaturization together with the increasing functionality of electronic devices, for example, mobile phones, camcorders, laptops, etc, has forced the semiconductor industry to develop, in ever-shorter cycle, smaller and thinner devices. The trend to CSPs (chip scale package) is becoming more and more important.
DRNTU::Engineering::Electrical and electronic engineering::Electronic packaging
Nanyang Technological University