Carbon doped silicon oxides for low k dielectric applications in multilevel interconnects.
Date of Issue2008
School of Electrical and Electronic Engineering
This project aims at deposition and characterization of carbon doped silicon oxides (SiOCH) low k dieletrics for multilevel interconnect applications. The optical, electrical, mechanical, structural and thermal properties of SiOCH films have been studied.
DRNTU::Engineering::Electrical and electronic engineering::Electric apparatus and materials
Nanyang Technological University