High-speed programmable divider for wireless communication.
Date of Issue2003
School of Electrical and Electronic Engineering
The recent boom in the wireless communication market has attracted the interest of almost all electronic and communication companies worldwide. The evolution in microelectronics has played a dominant role in this by creating digital signal processing (DSP) chips with more and more computing power and combining the discrete components of the Radio Frequency (RF) front on a few Integrated Circuits (ICs) or even on a single die. In order to be compatible with the digital processing technology, a standard CMOS process without tuning, trimming or post-processing steps must be used.
DRNTU::Engineering::Electrical and electronic engineering::Wireless communication systems
Nanyang Technological University