dc.contributor.authorChen, Junming.en_US
dc.date.accessioned2008-09-17T09:37:10Z
dc.date.available2008-09-17T09:37:10Z
dc.date.copyright2002en_US
dc.date.issued2002
dc.identifier.urihttp://hdl.handle.net/10356/3771
dc.description.abstractIn this work, the numerical results on the distribution of thermal stress at the interface of partial SOI structures are presented.en_US
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Electrical and electronic engineering::Semiconductors
dc.titleThe temperature distribution and thermal stresses induced during processing of partial SOI structures.en_US
dc.typeThesisen_US
dc.contributor.supervisorTan, Cher Ming.en_US
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen_US
dc.description.degreeMASTER OF ENGINEERING (EEE)en_US


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